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2 篇文献
 
An accurate semi-analytical framework for full-chip TSV-induced stress modeling  
TSV-induced stress is an important issue in 3D IC design since it leads to serious reliability problems and influences device performance. Existing finite element method can provide accurate analysis ......
Design Automation Conference  2013
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Thermomechanical stress-aware management for 3D IC designs  
The thermomechanical stress has been considered as one of the most challenging problems in three-dimensional integration circuits (3D ICs), due to the thermal expansion coefficient mismatch between th......
Design, Automation, and Test in Europe  2013
0次引用 0 0

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