Through Silicon Via
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In electronic engineering, a through-silicon via (TSV) is a vertical electrical connection (via (electronics)|via)(Vertical Interconnect Access) passing completely through a silicon wafer or die (integrated circuit)|die. TSVs are a high performance technique used to create 3D packages and 3D integrated circuits, compared to alternatives such as Package_on_package|package-on-package, because the density of the vias is substantially higher, and because the length of the connections is shorter.
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