0
喜欢
0
书签
声明论文
Three-dimensional Integrated Circuits: Design, EDA, and Architecture   
摘  要:   Abstract The emerging three-dimensional (3D) integration technology is one of the promising solutions to overcome the barriers in interconnection scaling, thereby offering an opportunity to continue performance improvements using CMOS technology. As the ...
发  表:   Foundations and Trends in Electronic Design Automation  2011

共享有1个版本

创新指数 
阅读指数 
重现指数 
论文点评
还没有人点评哦

Feedback
Feedback
Feedback
我想反馈:
排行榜